High-speed stamping machine manufacturer: What steps and machinery are needed to produce QFP package Lead frame and Semiconductor Lead Frame?

 

As a QFP package Lead frame high speed stamping machine manufacturer, many manufacturers who produce chip package LEAD FRAME may not know how Leadframe Power Semiconductor is produced in the early days? What machines and equipment are used to produce these Lead frames for a QFP package? Because many businessmen in China simply want to make money, so we not only provide metal substrate Lead frame press machine, we will also create one-stop services for customers to achieve a win-win goal in business.

 

The first is the stamping part, which is the very beginning of all production. First, Semiconductor Lead Frames Automatic are stamped and produced. The entire Semiconductor Lead Frame Chips DIPs High speed stamping production line consists of the following equipment, as shown in the figure:

1. Metal coil placement equipment (uncoiler, single workstation or double workstation available)

2. Metal plate straightening machine

3. Automatic feeder (high-speed feeder) (there are different types such as servo feeder, gear feeder, clamp feeder, roller feeder, etc.)

4. Thin metal plate part Lead Frames High Speed Presses (C-type high-speed press machine press and gantry H-type high-speed press are available)

The second production step is the laser marking process:

Because the raw material copper strip of the electronic circuit board Leadframe is an electroplated material, the mark can be directly laser printed using a laser marking machine to achieve permanent laser marking for traceability in semiconductor packaging.

 

The third production step is the injection molding process of the Lead frame for a QFP package.

After completing the bonding and wire bonding of the LSI chip, the next step is to injection mold the package.

Injection molding process flow:

First, the wire-bonded chip and lead frame are transferred to the lower mold for packaging, and then the upper mold is covered. To put it figuratively, the chip is placed into the cavity formed by the upper and lower molds. At this time, pressure is applied to the upper and lower molds at the same time to bring the molds into close contact, and then epoxy resin is injected into them, and the chip is tightly injection molded.

In actual practice, many chips are connected to a lead frame and then injection molded together.

 

The above is the stamping and manufacturing production process of Semiconductor Lead Frame Chips DIPs. If you want to get more information about Semiconductor Lead Frame Chips DIPs, please bookmark our website.